Academic Forum on AI-Enabled High-Speed Interconnection Successfully Held at Zhaolong Interconnect

Artificial intelligence (AI) brings infinite possibilities to economic and social development. High-speed interconnection serves as the guarantee for AI data transportation capacity, while AI supports the intelligent manufacturing of high-speed interconnection. On August 7, 2025, the "Academic Forum on AI-Enabled High-Speed Interconnection Frontiers" was successfully held in Deqing, Zhejiang, China.

This forum mainly discussed academic topics such as "AI Empowerment, Intelligent Manufacturing for the Future, Ultra-Fast Interconnection, and Signal Integrity". It focused on the innovative applications of AI technology in scenarios such as high-speed cables, connectors, and chip interconnections, and conducted discussions around the interconnection needs of new infrastructure such as computing power centers and data centers. It not only responded to engineering challenges such as signal integrity and electromagnetic compatibility in the design of high-speed data cables and connection products but also provided cutting-edge ideas for intelligent manufacturing, electronic design automation (EDA), and information technology upgrading.

The forum was co-hosted by several industry-university-research institutions, including Zhejiang Zhaolong Interconnect Technology Co., Ltd., College Information Science & Electronic Engineering of Zhejiang University, Zhejiang Key Laboratory of Intelligent Electromagnetic Control and Advanced Electronic Integration, Ningbo DeTooLIC Technology Co., Ltd., Faculty of Electrical Engineering and Computer Science in Ningbo University, School of Information and Electrical Engineering Hangzhou City University(Zhejiang University). Zhejiang Zhaolong Interconnect Technology Co., Ltd. undertook the forum. More than 20 doctoral and master's students from Zhejiang University and Ningbo University, as well as representatives of R&D and management backbones from Zhaolong Interconnect, attended the forum.

The forum was hosted by Yao Yuntao, Deputy General Manager of Zhaolong Interconnect. First, he grandly introduced the guests attending the forum. He said that through the joint discussion on "AI-enabled high-speed interconnection frontier academics", it would inject new momentum into the R&D and intelligent manufacturing of high-speed interconnection products and promote the high-quality development of the future high-speed interconnection industry.

Host's Speech: Building Cooperation Bridges to Promote Collaborative Innovation between AI and High-Speed Interconnection

Next, Yao Jinlong, Chairman of Zhaolong Interconnect, delivered a speech. He extended a warm welcome to professors, experts, graduate students, and participating representatives from Zhejiang University, Ningbo University, and the provincial key laboratory, and briefly introduced the company profile of Zhaolong Interconnect and the R&D of high-speed interconnection products. He said that he hoped all participants would take this forum as an opportunity to build cooperation bridges, establish close partnerships, and work together to promote the in-depth empowerment and collaborative innovation of artificial intelligence and high-speed interconnection technology, strive to produce more high-level academic achievements, and help high-speed interconnection technology achieve sustainable development.

Wonderful Reports: In-depth Integration of Artificial Intelligence and High-Speed Interconnection Product R&D

The keynote reports of this forum were hosted by Dr. He Fang, Chief Expert of Zhaolong Interconnect Cable Connection System and Director of the Laboratory, and an IEEE member. He grandly introduced the research fields, latest achievements, and report summaries of various senior professors and experts.

01 Dr. Fan Jun: <Challenges and Trends in High-Speed Interconnection Design>

Dr. Fan Jun, Chairman of Ningbo DeTooLIC Technology Co., Ltd. and IEEE Fellow, gave a sharing on the theme of Challenges and Trends in High-Speed Interconnection Design. He believes that with the vigorous development of emerging applications such as artificial intelligence and robots, the challenges faced by interconnection and high-speed design technologies are intensifying. He profoundly explained the development trends and design points of high-speed interconnection (especially high-speed cables) in terms of signal integrity and electromagnetic compatibility. Combined with the new challenges brought by multi-power domain coupling, he introduced the technical path of positioning and rectification through visualization technology; at the same time, he put forward the causes and solutions of common radio frequency interference problems, providing practical technical references for high-speed interconnection design.

02 Hu Haoji: <Viewing the Development of Artificial Intelligence from DEEPSEEK>

Hu Haoji, Associate Professor and Doctoral Supervisor of the School of Information and Electrical Engineering Hangzhou City University(Zhejiang University), shared on the theme of Viewing the Development of Artificial Intelligence from DEEPSEEK. He introduced that the emergence of DeepSeek in 2025 has brought a new dawn for the development of simple models. Combining his team's research experience, he deeply analyzed the technical path of DeepSeek, expounded its three core methods for building simple models — Multi-head Latent Attention (MLA), Mixture of Experts Optimization (MOE), and model knowledge distillation technology. He also explained how these methods balance model efficiency and performance based on his own practice in the field of AI model optimization. Finally, he elaborated on the specific application scenarios of large models in intelligent design, intelligent manufacturing, and intelligent R&D of information products.

03 Wang Jian: <Challenges, Methods, and Applications of EMC/EMI Simulation for Complex Cable/Bundle Networks>

Wang Jian, Vice Dean, Professor, and Doctoral Supervisor of Faculty of Electrical Engineering and Computer Science of Ningbo University, gave a speech on the theme of Challenges, Methods, and Applications of EMC/EMI Simulation for Complex Cable/Bundle Networks. He said that in view of the characteristics of variable platform noise, cross-level energy coupling, and complex structure, his team has carried out a lot of research in the fields of field-line coupling, cable crosstalk, cable radiation, and AI-assisted cable electromagnetic interference simulation. He hopes that numerical simulation can analyze electromagnetic performance in the initial design stage of equipment to find defects as early as possible and reduce costs; however, there are still technical bottlenecks in current system-level EMC/EMI collaborative simulation, which need to be broken through urgently.

04 Zhang Ling: <AI-Enabled Efficient Design Methods for Chip Signal and Power Integrity>

Zhang Ling, Hundred Talents Program Researcher and Doctoral Supervisor of Zhejiang University, shared on the theme of AI-Enabled Efficient Design Methods for Chip Signal and Power Integrity. He believes that with the iteration of integrated circuit and chiplet technologies, the challenges of signal and power integrity are intensifying, and AI has injected new impetus into electronic design automation. He shared his team's AI-based efficient design methods for integrated circuit signal and power integrity, covering the AI-optimized design process and the paths to improve efficiency and accuracy. Combining the development trend of chip technology, he analyzed the limitations of traditional design methods in complex interconnection scenarios, emphasized that AI is a key support to break through the bottleneck, and discussed the opportunities and challenges in this field, providing cutting-edge references for chip design practitioners.

05 Yin Wenyan: <Neural Network Intelligent Design Methods for High-Speed Cables and Connectors>

Yin Wenyan, Qiushi Distinguished Professor, Doctoral Supervisor of the College of Information Science and Electronic Engineering of Zhejiang University, and IEEE Fellow, gave a wonderful sharing on the theme of Neural Network Intelligent Design Methods for High-Speed Cables and Connectors. He introduced the practice of intelligent design based on deep learning — by building a neural network model adapted to high-speed/high-frequency scenarios, the agile design and rapid optimization of performance such as signal integrity and electromagnetic compatibility are realized. Combined with engineering cases, he showed the effect of AI algorithms in accurately optimizing parameters and shortening the design cycle. He believes that this research not only provides intelligent tools for the efficient design of high-speed cables and connectors but also is expected to promote the upgrading of wireless communication and Internet of Things technologies, and help the miniaturization and high performance of new generation electronic devices.

This forum has built a high-level academic platform for ideological collision, wisdom integration, and win-win cooperation. Participating professors and experts spoke freely, shared their insights, sparked innovative sparks, and solved common problems. Frontier exploration is endless, and cooperative innovation can lead to a long-term future. We look forward to accelerating the transformation of "AI + high-speed interconnection" from theoretical exploration to engineering practice through in-depth dialogue between industry, university, and research, and injecting new impetus into the technical upgrading and innovative application of the high-speed interconnection industry.