Electronica China 2026, themed Innovation-Driven, Smart Connectivity Shapes the Future, will take place from July 1 to 3 at the Shanghai New International Expo Centre (SNIEC).

Zhaolong Interconnect will showcase our comprehensive connectivity products and tailored solutions for AI data center infrastructure at Booth W3.521, Hall W3, 1st Floor, demonstrating our full-spectrum high-speed interconnect capabilities.

Ethernet High-Speed Interconnect: DAC & ACC

Driven by ever-growing requirements for higher port speed and density across AI clusters and cloud data centers, short-reach copper interconnect remains the most cost-efficient solution for intra-rack and inter-rack connections.

We present a complete product portfolio covering passive Direct Attach Copper (DAC) cables from 10G to 1.6T, alongside Active Copper Cable (ACC/AEC) solutions ranging from 40G up to 1.6T. Our products support mainstream form factors including SFP, QSFP, QSFP-DD, OSFP, OSFP-RHS and OSFP-IHS, featuring wide compatibility with switches, network interface cards and servers from all major vendors. They greatly simplify equipment deployment and iterative adaptation, lowering overall system integration costs and technical barriers.

Core Highlight Products

1. 1.6T OSFP DAC/ACC

   Adopting an 8×200G architecture and leveraging our in-house developed HSC-60 high-speed twinaxial cable, this solution delivers ultra-low latency and power consumption. It perfectly accommodates high-bandwidth dense deployment in AI backend networks, delivering stable, high-efficiency copper interconnect for next-generation data centers.

2. 400G–1.6T ACC/AEC Active Copper Cables

   Optimized for long-distance cabling and stringent signal integrity scenarios, our full-rate active interconnect lineup integrates built-in signal compensation technology. It balances low power draw with reliable high-speed signal transmission, providing flexible options for diverse medium-to-long reach computing infrastructure deployments.

PCIe 5.0/6.0 & Upcoming PCIe 7.0 Server Internal High-Density Interconnect

For ultra-high-bandwidth internal transmission inside servers, storage arrays and AI accelerators, Zhaolong has established a mature full-stack product matrix for PCIe 5.0 and 6.0, while conducting forward-looking R&D on PCIe 7.0 technology.

Our showcased solutions include PCIe DA-CEM, PCIe X16 Riser Cables, OSFP-XD DAC/AEC, CDFP x16 DAC/ACC and SFF-8614 MiniSAS HD assemblies.

As server internal interconnect evolves toward higher density and bandwidth for AI data centers, our SFF-TA-1016 compliant MCIO product family covers pin configurations from 38PIN to 148PIN. We also exhibit a wide range of internal interconnect solutions such as PCIe 5.0/6.0 EDSFF, Multi-Trak, OCP 4C+ and Cloud Card X16/X32 Plug modules, delivering stable, high-throughput internal connectivity for AI servers and cloud computing infrastructure.

High-Speed Twinaxial Cables & In-House R&D Capacity

We will demonstrate our high-speed twinaxial cables supporting 448G PAM4 modulation, alongside official insertion loss test curves on-site. Our twinaxial cables are available in ground-free, single-ground and dual-ground structures, covering wire gauges from 26AWG to 32AWG with customizable impedance. Both loose cables and finished cable assemblies are available for delivery.

Our self-manufactured high-performance bare cables underpin the independent R&D and mass production of our full-range high-speed interconnect components, enabling maximum flexibility for customized customer solutions. Currently, our HSC-60 twinaxial cable designed for 224G PAM4 transmission has been fully mass-produced.

We warmly invite global customers, industry partners and all exhibition attendees to visit Booth W3.521, Hall W3, 1st Floor. Come discuss technical details and explore mutually beneficial cooperation opportunities with our professional team.