Twinax Cables Power AI Data Centers​​： AI’s boom drives data centers to ultra-high speeds (400G–1.6T). Twinax cables, key connective media for DAC/ACC/AEC, emerge as "transmission powerhouses" (28G–224G) via low-latency, high-bandwidth, anti-interference design. Zhaolong’s HSC bare wires, using self-developed FEP foam and silver-plated copper, offer cost-effective solutions (32–26AWG, 2–16 pairs, 28G–224G). Lightweight, foldable, they save space/power vs fiber, boosting client tech leadership in AI/HPC/data centers.

From June 3 to June 5, ANGACOM 2025—a leading global professional exhibition in the fields of optical fiber communication, network technology, and data centers—was grandly held at the Cologne International Exhibition Center.At Hall 7, Booth F20, as a leading exporter in China’s data cable industry, Zhaolong Interconnect showcased its latest AI Computing Center & Data Center Products & Solutions, Smart Building Cabling Systems and Intelligent Manufacturing Cabling Systems.

On May 27th, Asia's most representative ICT event and a global communication innovation "vane", the exhibition AsiaTech Singapore, will kick off at the Singapore Expo Center. At Booth 3E3-14, Zhaolong Interconnect (SZ.300913) will showcase data cables and cable connection solutions for AI computing centers, smart buildings, and intelligent manufacturing, comprehensively demonstrating the company's innovative strengths in data cables, special cables, and connection products.

Zhaolong cordially invites you to join us at OFC 2025 in the United States and HANNOVER MESSE in Germany, as we empower the AI era with high-speed and reliable connectivity solutions.

For smaller-scale data centers, deploying high-speed copper interconnects—such as Direct Attach Copper (DAC), Active Copper Cables (ACC), and Active Electrical Cables (AEC)—ensures low-latency, high-throughput intra-data center connectivity, as validated by industry benchmarks. This article explores this paradigm shift and its practical implementation.

Zhaolong Interconnect showcased at CES 2025 with its interconnect solutions for high-speed data centers, servers, robots and other scenarios, helping to boost AI computing power.