The Connectivity Cornerstone in the Rapid Evolution of Computing Power

As AI and computing centers rapidly expand, servers are moving toward a high-density era. The intensive deployment of GPUs, accelerators, and switch chips increasingly crowds the internal space of racks. In this context, the often-overlooked element is the cable — it is no longer a supporting actor, but the connectivity cornerstone in high-density computing architectures, determining system stability and scalability.

Three Major Connectivity Challenges in High-Density Computing Systems

Computing center interconnects are undergoing a profound transformation. From a practical deployment perspective, three key challenges have emerged at the connection layer:

Connection scale grows exponentially, making high density the norm. The number of interconnection links within racks is increasing exponentially. High-density, large-scale deployment has become standard.

Physical space continues to shrink, driving cabling complexity. High device integration severely constrains available cabling space, imposing stricter demands on cable flexibility, bend radius, and component integration.

Transmission rates continue to rise, sharply raising performance requirements. Speeds are advancing from 800 Gb/s toward 1.6 Tb/s and beyond. This not only demands higher bandwidth but also subjects signal integrity (SI) to system-level challenges.

HSC-60 High-Speed Cables: A Foundational Cable for Future Interconnects

Zhaolong Interconnect's HSC-60 series high-speed twin-axial cables are foundational core components specifically designed for next-generation short-reach, high-speed interconnects in computing centers.

Core Performance

Supports single-channel 224 Gb/s (PAM4) transmission, enabling next-generation single-channel 200G Ethernet and PCIe 7.0 applications, providing the physical interconnect foundation for 800 Gb/s and 1.6 Tb/s systems.

Based on this single-channel performance, it supports eight-channel (8x224 Gb/s) mainstream form factors such as OSFP, allowing the construction of system-level interconnect solutions supporting 1.6 Tb/s and beyond.

Impedance Matching

Offers both 92Ω and 85Ω impedance versions to precisely match the electrical requirements of different protocols (e.g., Ethernet, InfiniBand).

System Value

In high-speed interconnect systems, the performance of the base cable determines the ceiling for the entire cable assembly. The HSC-60 series, with its high bandwidth of up to 67 GHz and excellent signal integrity, provides a reliable physical-layer core for DAC, ACC, and AEC in form factors such as OSFP 1600. Its single-channel 224 Gb/s (PAM4) transmission capability is the key enabler for next-generation single-channel 200G Ethernet and PCIe 7.0 standard applications.

Application Scenario 1: High-Speed Interconnect Within Server Racks

As AI servers evolve toward high-density GPU clusters, a large number of ultra-short-reach, ultra-high-bandwidth links must be deployed inside racks.

HSC-60 Advantages

Supports high-density design – As the core of Zhaolong's OSFP 1600 DAC cable assemblies, it facilitates higher-density link deployment within limited space.

Balances flexibility and cooling – Excellent flexibility enables neater cabling, helping to improve airflow and reduce cooling challenges inside racks.

Ensures signal integrity – At 1.6T and above, its low-loss, low-crosstalk characteristics provide a stable channel for high-speed data exchange between GPUs.

Application Scenario 2: Inter-Rack and Short-Reach High-Speed Interconnect

Short-reach interconnect scenarios between racks or boards have diverse requirements for flexibility, cost, and performance balance.

HSC-60 Advantages

Based on its stable SI performance, the HSC-60 series supports 224 Gb/s (PAM4) and adapts to link distances ranging from tens of centimeters to several meters. This provides a unified cable foundation for developing various interconnect solutions such as DAC, ACC, and AEC, helping system designers optimize performance, power consumption, and cost.

Looking Ahead: Building a Sustainable Compute Connectivity Foundation

Computing centers have long construction cycles. To prevent frequent overhauls of foundational interconnects due to speed upgrades, the HSC-60 series was designed from the outset with future upgrade needs in mind — enabling sustainable adaptation and reducing customers' long-term investment costs.

Bandwidth headroom – Supports single-channel 224 Gb/s (PAM4) transmission. For 112 Gbaud PAM4 signals, the Nyquist frequency is 56 GHz. The 67 GHz bandwidth provides physical-layer headroom for current and future applications.

Smooth evolution – Fully compatible with next-generation high-speed interface standards such as OSFP 1600 and QSFP-DD 1600, ensuring existing infrastructure can transition smoothly to next-generation network architectures and guaranteeing long-term usability.

Technology continuity – While the HSC-60 series meets current 800G/1.6T demands, its forward-defined "single-channel 200G+" capability is prepared for upcoming higher-speed standards like PCIe 7.0. The company is already developing next-generation cable technologies such as the HSC-110 series to continuously address future interconnect challenges and protect customers' long-term technology investments.

Corporate Strength: Deeply Rooted in High-Speed Interconnect Foundations

Zhaolong Interconnect (Stock Code: 300913), since its founding in 1993, has consistently focused on the R&D and manufacturing of data cables, specialty cables, and connection products. The company is a full member of the China Communications Standards Association, a drafting unit for national data cable standards, and one of the few in the industry capable of delivering 400G/800G/1.6T connectivity solutions based on a complete in-house process.

For over 30 years, the company's core technology and product development have kept pace with Ethernet evolution. Through continuous R&D investment and innovation, it has accumulated multiple patents in structure, process, and testing, while steadily improving production and test automation. Today, its products are sold in more than 100 countries and regions, widely used in mainstream markets such as 5G communications, cloud computing, data centers, and industrial automation, and have extended into high-reliability specialty scenarios including medical, wind power, and marine applications.

The company's core strengths are mainly reflected in two dimensions:

Full-spectrum coverage of high-speed interconnects. Since 2010, the company has completed its full-series layout of high-speed interconnect products from 10G to 800G/1.6T, making it one of the few domestic enterprises with integrated delivery capabilities — from core cable to finished assemblies.

Participation in industry standard co-creation. The company is deeply involved in shaping cutting-edge industry specifications, as shown by: In 2020, co-publishing the "Next-Generation Data Center High-Speed Copper Cable Technology White Paper" (copyright held by ODCC) alongside major data center users such as Alibaba and Baidu and domestic DAC manufacturers including Luxshare and Zhaolong Interconnect. In 2021, joining with 30 other companies — including Alibaba, Baidu, Luxshare, and Innolight — to form the QSFP112 MSA Association and jointly release the Q112 MSA specification.